Heat radiation component and method for manufacturing heat radiation component

ABSTRACT

A heat radiation component includes a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2012-173143 filed on Aug. 3, 2012, the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to a heat radiation component and a method for manufacturing a heat radiation component.

BACKGROUND

A semiconductor device used for a CPU (Central Processing Unit) or the like generates heat at a high temperature during operation. Therefore, in order to form the semiconductor device to exhibit a satisfactory performance, it is important to rapidly radiate the heat outside the semiconductor device.

Conventionally, a heat radiation component such as a heat spreader or a heat pipe is attached to the semiconductor device for ensuring a path to effectively radiate the heat generated by the semiconductor device. Further, studies are being conducted for improving the heat radiating (heat releasing) performance of the heat radiation component such as the heat spreader or the heat pipe. For example, as one approach for improving the heat radiating (heat releasing) performance of the heat radiation component, a metal layer having carbon materials (e.g., carbon nanotubes) distributed therein is formed on a surface of the heat radiation component (e.g., heat spreader, heat pipe).

Some examples of a method for distributing carbon materials (e.g., carbon nanotubes) inside a metal layer are as follows. The first method is to arrange carbon nanotubes substantially in a vertical direction by injecting a plating liquid including carbon nanotubes into holes that are narrower than the fiber length of the carbon nanotubes (see, for example, Japanese Laid-Open Patent Publication No. 2006-152372). A second method is to form a metal plating layer by an electroplating process, so that carbon nanotubes are in a vertical direction along an electrical flux line (see, for example, Japanese Laid-Open Patent Publication No. 2001-283716).

However, with the first method, although a portion of the carbon nanotubes can be arranged in a vertical direction, most of the carbon nanotubes are arranged diagonally with respect to the holes formed in a resist film of a substrate. With the second method, although the proportion of vertical carbon nanotubes may be increased, a large portion of the carbon nanotubes is still diagonally arranged because the power of the electrical flux line of the electroplating process is insufficient. Therefore, with the conventional methods, it is difficult for carbon materials (e.g., carbon nanotubes) to be entirely arranged in a vertical direction.

SUMMARY

According to an aspect of the invention, there is provided a heat radiation component including a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate.

The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view illustrating a heat radiation component according to a first embodiment of the present invention;

FIGS. 2A and 2B are schematic diagrams for describing processes for manufacturing a heat radiation component according to the first embodiment of the present invention;

FIGS. 3A and 3B are schematic diagrams for describing processes for manufacturing a heat radiation component according to a second embodiment of the present invention; and

FIG. 4 is a graph illustrating the results for confirming a heat radiating property of a heat radiation component according to an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

In the following, illustrative embodiments of the present invention are described with reference to the accompanying drawings. Throughout the drawings, like components/parts may be denoted with like reference numerals and further description thereof may be omitted.

First Embodiment Structure of Heat Radiation Component of First Embodiment

First, a structure of a heat radiation component according to a first embodiment of the present invention is described. FIG. 1 is a cross-sectional view illustrating a heat radiation component 1 according to the first embodiment of the present invention. With reference to FIG. 1, the heat radiation component 1 includes a substrate 10 and a carbon material layer 20.

The substrate 10 is preferably formed of a metal material having a satisfactory thermal conductivity. The metal material may be, for example, copper (Cu), aluminum (Al), iron (Fe), or an alloy including any of these metals. It is, however, to be noted that a material other than metal may be used as long as the material can provide a satisfactory thermal conductivity.

The carbon material layer 20 includes a plating layer 22 formed on a surface 10 a of the substrate 10. The plating layer 22 includes carbon nanotubes 21. The plating layer 22 is formed filling the spaces between the carbon nanotubes 21. The thickness T of the plating layer 22 is, for example, approximately 50 μm. The carbon nanotubes 21 are arranged (oriented) orthogonal to the surface 10 a of the substrate 10. A part of each of the carbon nanotubes 21 protrudes from a surface of the plating layer 22 in a direction opposite to the substrate 10.

In this embodiment, the term “orthogonal” does not only refer to the carbon nanotubes 21 being completely orthogonal to the surface 10 a of the substrate 10 but also to the carbon nanotubes 21 being substantially orthogonal to the surface 10 a of the substrate 10 to the extent of being able to attain the below-described effects of the heat radiation component 1.

The part of each of the carbon nanotubes 21 protruding from a surface 22 a of the plating layer 22 may hereinafter also be referred to as a protruding part of the carbon nanotube 21. The amount L by which the protruding part of the carbon nanotube 21 protrudes from the surface 22 a of the plating layer 22 (protrusion amount L) is, for example, approximately 5 μm to 10 μm. It is to be noted that the carbon nanotubes 21 may have different protrusion amounts L. A projected area (from a plan view) of the protrusion parts of the carbon nanotubes 21 is, for example, 3% or more with respect to the area of an upper surface of the plating layer 22.

In order to prevent degradation of heat radiation performance, the protrusion amount L is preferred to be greater than 5 μm. On the other hand, in order to prevent the carbon nanotube 21 20, from being bent (damaged) or falling off from the plating layer 22, the protrusion amount L is preferred to be less than 10 μm.

The diameter of the carbon nanotube 21 is, for example, approximately 100 nm to 300 nm. The length of the carbon nanotube 21 is, for example, approximately 55 μm to 60 μm. For example, tens of thousands of carbon nanotubes are formed standing close together on the surface 10 a of the substrate 10.

The material of the plating layer 22 is preferably a metal having satisfactory thermal conductivity and having a rust-resistant property. For example, nickel (Ni), copper (Cu), cobalt (Co), gold, (Au), silver (Ag), or palladium (Pd) may be used as the material of the plating layer 22.

It is to be noted that other carbon materials such as carbon nano-fiber, graphite, or carbon black may be used instead of the carbon nanotubes 21. Further, a combination of any of these carbon materials may be used instead of the carbon nanotubes 21.

The heat radiation component 1 can be applied to, for example, a vapor chamber, a heat pipe, a heat spreader, or a casing of an LED (Light Emitting Diode). That is, by attaching the substrate 10 of the heat radiation component 1 to a heat generating element (e.g., semiconductor device), the heat generated by the heat generating element can be rapidly transmitted to a surface of the carbon material layer 20 via the substrate 10.

Method for Manufacturing Heat Radiation Component of First Embodiment

Next, a method for manufacturing a heat radiation component according to the first embodiment of the present invention is described. FIGS. 2A and 2B are schematic diagrams for describing processes for manufacturing the heat radiation component of the first embodiment. In the process illustrated in FIG. 2A, the substrate 10 is prepared. Then, as illustrated in FIG. 2A, the carbon nanotubes 21 are formed standing close together on the substrate 10, in a manner that the carbon nanotubes 21 are arranged (oriented) in an orthogonal direction with respect to the surface 10 a of the substrate 10.

The substrate 10 is preferably formed of a metal material having a satisfactory thermal conductivity. The metal material may be, for example, copper (Cu), aluminum (Al), iron (Fe), or an alloy including any of these metals. It is, however, to be noted that a material other than metal may be used as long as the material can provide a satisfactory thermal conductivity.

The carbon nanotubes 21 are formed directly on the surface 10 a of the substrate 10 by using a CVD (Chemical Vapor Deposition) method, so that the carbon nanotubes 21 are arranged in the orthogonal direction with respect to the surface 10 a of the substrate 10. More specifically, the substrate 10 is placed in a heating furnace that is adjusted to a predetermined pressure and temperature. Then, the carbon nanotubes 21 are formed on the surface 10 a of the substrate 10 by performing a CVD process on the substrate 10. The pressure inside the heating furnace is, for example, approximately 100 Pa, and the temperature inside the heating furnace is, for example, approximately 600° C. The process gas used in the CVD process may be, for example, acetylene gas. The carrier gas used in the CVD process may be, for example, argon gas or hydrogen gas.

Thereby, multiple carbon nanotubes 21, which are arranged in a direction orthogonal to the surface 10 a of the substrate 10, are formed on the surface 10 a of the substrate 10. Each of the carbon nanotubes 21 has one end contacting the surface 10 a of the substrate 10.

The diameter of the carbon nanotube 21 is, for example, approximately 100 nm to 300 nm. The length of the carbon nanotube 21 is, for example, approximately 55 μm to 60 μm. The number of carbon nanotubes 21 is, for example, approximately tens of thousands of carbon nanotubes 21. The length of the carbon nanotube 21 (distance from the surface 10 a of the substrate 10 to a distal end of the carbon nanotube 21) can be controlled by adjusting the time of growth of the carbon nanotube 21.

In a case where a material other than metal is used for the substrate 10, a metal catalyst layer may be formed on the surface 10 a of the substrate by using, for example, a sputtering method. In this case, the carbon nanotubes 21 are formed on the metal catalyst layer by performing a CVD process on the substrate 10. For example, iron (Fe), cobalt (Co), or nickel (Ni) may be used to form the metal catalyst layer. The thickness of the metal catalyst layer is, for example, approximately a few nm.

Then, in the process illustrated in FIG. 2B, the plating layer 22 is formed on the surface 10 a of the substrate 10 to obtain a carbon material layer 20 that includes the plating layer 22 having the carbon nanotubes 21 provided therein. In other words, the plating layer 22 is formed by filling (supplying) a plating material in the spaces between the carbon nanotubes 21, so that a part of each of the carbon nanotubes 21 protrudes from the surface 22 a of the plating layer 22 in a direction opposite from the substrate 10. The thickness of the plating layer 22 is, for example, approximately 50 μm.

The amount L by which the protruding part of the carbon nanotube 21 protrudes from the surface 22 a of the plating layer 22 (protrusion amount L) is, for example, approximately 5 μm to 10 μm. It is to be noted that the carbon nanotubes 21 may have different protrusion amounts L. A projected area (from a plan view) of the protrusion parts of the carbon nanotubes 21 is, for example, 3% or more with respect to the area of an upper surface of the plating layer 22.

With the heat radiation component 1 according to the first embodiment of the present invention, a part of each of the carbon nanotubes 21 (i.e., protruding part) protrudes from the surface 22 a of the plating layer 22 in a direction opposite to the substrate 10. Accordingly, heat that is transmitted from the substrate 10 can be radiated from the protruding part of each of the carbon nanotubes 21. Hence, the heat radiating property of the carbon material layer 20 can be improved.

Further, because each of the carbon nanotubes 21 is constituted by fibers that are oriented in a longitudinal direction of the carbon nanotube 21, the orientation of the fibers can be sufficiently utilized to further improve the heat radiating property of the carbon material layer 20.

Modified Example of First Embodiment

Although the plating layer 22 is formed by using the electroplating method according to the first embodiment, the plating layer 22 may be formed by using an electroless plating method.

In forming the plating layer 22 with the electroless plating method, first, the above-described processes illustrated in FIG. 2A are performed. Then, an electroless plating process is performed on the substrate 10 instead of the electroplating method in the process illustrated in FIG. 2B. For example, Ni—P, Ni—B, or Cu may be used as the material of the electroless plating method. The same effects as those of the first embodiment can be attained by forming the plating layer 22 with the electroless plating method.

Second Embodiment

In the following second embodiment of the present invention, the heat radiation component 1 is manufactured by using a method different from the method used in the first embodiment. In the second embodiment, like components/parts are denoted by the same reference numerals as the reference numerals of the first embodiment and are not further explained.

FIGS. 3A and 3B are schematic diagrams for describing processes for manufacturing the heat radiation component 1 of the second embodiment. In the process illustrated in FIG. 3A, the substrate 10 is prepared. Then, the substrate 10 is placed in a magnetic field generating apparatus (not illustrated). By activating the magnetic field generating apparatus (not illustrated), a magnetic field M is generated in a direction orthogonal to the surface 10 a of the substrate 10. For example, an apparatus using a superconducting magnet may be used as the magnetic field generating apparatus (not illustrated). The magnetic field M is, for example, approximately 5 T (teslas) to 10 T (teslas). The material used for the substrate 10 may be the same as the material used for the substrate 10 of the first embodiment.

Then, in the process illustrated in FIG. 3B, the carbon material layer 20 is formed having the carbon nanotubes 21 provided in the plating layer 22. In other words, the plating layer 22 is formed by filling a plating material in the spaces between the carbon nanotubes 21, so that a part of each of the carbon nanotubes 21 protrudes from the surface 22 a of the plating layer 22 in a direction opposite to the substrate 10.

More specifically, first, a material of the carbon nanotubes 21 (hereinafter also referred to as “carbon nanotube material 21”) is dispersed in an electroplating liquid used for forming the plating layer 22. Then, the electroplating liquid having the carbon nanotube material 21 dispersed therein is used to perform an electroplating process on the surface 10 a of the substrate 10 inside the magnetic field M. Thereby, the carbon material layer 20 is formed including the plating layer 22 having the carbon nanotubes 21 provided therein.

For example, nickel (Ni), copper (Cu), cobalt (Co), gold (Au), silver (Ag), or palladium (Pd) may be used as the material of the plating layer 22. A material that is not affected or hardly affected by the magnetic field M is preferred to be used as the plating layer 22. It is to be noted that the plating layer 22 is formed, so that a part of each of the carbon nanotubes 22 protrudes from the surface 22 a of the plating layer in a direction opposite to the substrate 10.

By dispersing a large amount of carbon nanotube material 21 in the electroplating liquid used to form the plating layer 22 and applying the magnetic field M in a direction orthogonal to the surface 10 a of the substrate 10, a large number of carbon nanotubes 21 can be formed on the surface 10 a of the substrate 10 in a direction orthogonal to the surface 10 a of the substrate. Details such as the thickness of the plating layer 22 or the amount in which the carbon nanotubes 21 protrude from the surface 22 a are substantially the same as those described in the first embodiment. It is to be noted that, in some cases, the ends of the carbon nanotubes 21 of the second embodiment do not contact the surface 10 a of the substrate 10.

It is preferable to blend the electroplating liquid used in FIG. 3B with a polyacrylic acid to be used as a dispersing agent for dispersing the carbon nanotube material 21. Further, it is also preferable to blend the electroplating liquid with an alkanediol compound, an alkenediol compound, or an alkynediol compound to be used as a brightening agent.

As the brightening agent, it is particularly preferable to use an alkynediol compound including alkynediol molecules having an oxyethylene side chain in which the oxyethylene side chain constitutes at least 20% by weight of the molecular weight of the alkynediol compound. It is preferable for the oxyethylene side chain to constitute 85% or less by weight of the molecular weight of the alkynediol compound.

Further, it is preferable to blend the electroplating liquid with: an organic compound including a ketone group, an aldehyde group, or a carboxylic acid group; a carbon mono oxide compound with a coumarin derivative; an aryl aldehyde sulfone compound; a sulfone compound including an aryl group; an alkylene carboxy ester; an alkylene aldehyde; an acetylene derivative; a pyridinium compound; an alkane sulfonic compound; or an azo compound to be used as a surface activating agent. In dispersing the carbon nanotube material 21 in the electroplating liquid, it is preferable to immerse the carbon nanotube material 21 in a dispersing agent beforehand, so that the dispersibility of the carbon nanotube material 21 is enhanced. Then, the carbon nanotube material 21 having enhanced dispersibility is mixed with the electroplating liquid.

The amount of the carbon nanotube material 21 mixed with the electroplating liquid (mixture amount) is preferably greater than or equal to 100 ppm (more preferably, equal to or greater than 500 ppm, even more preferably, equal to or greater than 1000 ppm). The upper limit of the mixture amount of the carbon nanotube material 21 is approximately 1% by weight. In a case where the mixture amount of the carbon nanotube material 21 exceeds 1% by weight, it becomes difficult to disperse the carbon nanotube material 21.

When performing the electroplating process with the electroplating liquid having the carbon nanotube material 21 dispersed therein, it is preferable to perform the electroplating process with a current density of 5 A/dm² while agitating the electroplating liquid, so that the carbon nanotube material 21 can be maintained in a dispersed state during the electroplating process. In a case where the electroplating process is performed with a current density exceeding 5 A/dm², the plating layer 22 tends to be formed having a rugged surface.

Prior to performing the electroplating process, the substrate 10 is connected to a cathode of a direct current power source (not illustrated) and placed orthogonal to a liquid surface of the electroplating liquid. Further, an anode plate (not illustrated), which is connected to an anode of the direct current power source (not illustrated), is placed on a side of the surface 10 a (i.e., surface on which the electroplating process is to be performed) of the substrate 10. Then, the electroplating process is performed while oscillating the substrate 10 and the anode plate (not illustrated) in a horizontal direction. Thereby, the carbon nanotubes 21 can be evenly arranged on the surface 10 a of the substrate 10. In addition, a part of each of the carbon nanotubes 21 can be formed protruding from the surface 22 a of the plating layer 22.

Hence, the carbon material layer 20 having the carbon nanotubes 21 provided in the plating layer 22 can also be formed by dispersing the carbon nanotube material 21 in the electroplating liquid used for forming the plating layer 22 and performing an electroplating process in the magnetic field by using the electroplating liquid. The heat radiation component 1 formed by the above-described method of the second embodiment can attain the same effects as the heat radiation component 1 of the first embodiment.

In the processes illustrated in FIG. 3B of the second embodiment, an electroless plating method may be used instead of the electroplating method. In this case, for example, Ni—P, Ni—B, or Cu may be used as the material of the plating layer 22. Further, the carbon nanotube material 21 is dispersed in an electroless plating liquid used for forming the plating layer 22. Then, the carbon material layer 20 having the carbon nanotubes 21 provided in the plating layer 22 is formed by performing an electroless plating process on the surface 10 a of the substrate 10 in the magnetic field M.

EXAMPLES

In order to confirm the heat radiating property, a sample of the heat radiation component 1 manufactured with the method of the first embodiment was prepared (hereinafter also referred to as “example 1”). In the example 1, copper (Cu) was used as the material of the substrate 10, and nickel (Ni) was used as the material of the plating layer 22. The thickness T (see FIG. 1) of the plating layer 22 was approximately 50 μm, and the protrusion amount L (see FIG. 1) of the protruding part of the carbon nanotubes is approximately 5 μm to 10 μm.

Then, in order to compare with the heat radiating property of example 1, another sample of a heat radiation component X manufactured with a method similar to the second embodiment was prepared (hereinafter also referred to as “comparative example X”). It is, however, to be noted that the comparative example X was manufactured without using the magnetic field generating apparatus (not illustrated). That is, the carbon material layer 20 having the carbon nanotubes 21 provided in the plating layer 22 was manufactured by dispersing the carbon nanotube material 21 in the electroplating liquid used for forming the plating layer 22 and performing an electroplating process by using the electroplating liquid in a state where no magnetic field M is generated.

As a result, although a part of each of the carbon nanotubes 21 of the comparative example X protrudes from the surface 22 a of the plating layer 22 in a direction opposite to the substrate 10, the carbon nanotubes 21 of the comparative example X were arranged in random directions with respect to the surface 10 a of the substrate 10. In other words, the main difference between the carbon nanotubes 21 of the example 1 and the comparative example X is that the carbon nanotubes 21 of the example 1 were arranged (oriented) orthogonal to the surface 10 a of the substrate 10 whereas the carbon nanotubes 21 of the comparative example X were arranged in random directions with respect to the surface 10 a of the substrate 10.

After manufacturing the samples, each of the samples were attached to a predetermined block together with a heater and a thermometer. The heat radiation component 1 (example 1) and the heat radiation component X (example X) were alternately mounted on the block. Then, the temperature for each of the samples was measured in a state where a constant voltage was applied to the heater for 30 minutes. The result of the measurement is illustrated in FIG. 4. In FIG. 4, a sample having a small amount of temperature rise during 30 minutes signifies that the sample has a satisfactory heat radiating property.

As illustrated in FIG. 4, the temperature of the heat radiation component X (comparative example X) after the elapse of 30 minutes was approximately 68.3° C. In contrast, the temperature of the heat radiation component 1 (example 1) after the elapse of 30 minutes was approximately 66.9° C. The heat radiating property of the heat radiation component 1 (example 1) is improved 1.4° C. in comparison with the heat radiating property of the heat radiation component X (comparative example X).

As described above, the carbon nanotubes 21 of the heat radiation component X were arranged in random directions with respect to the surface 10 a of the substrate 10. Therefore, some of the distal ends of the carbon nanotubes 21 of the heat radiation component X were bent or abutting the surface 2 a of the plating layer 22. Thus, some of the carbon nanotubes 21 of the heat radiation component X were unable to contribute to heat radiation. As a result, it is evaluated that heat cannot be sufficiently radiated from the carbon nanotubes 21 of the heat radiation component X.

On the other hand, the carbon nanotubes 21 of the heat radiation component 1 were arranged orthogonal to the surface 10 a of the substrate 10. Therefore, hardly any of the distal ends of the carbon nanotubes 21 of the heat radiation component 1 were bent or abutting the surface 2 a of the plating layer 22. Thus, almost all of the carbon nanotubes 21 included in the plating layer 22 of the heat radiation component 1 were able to contribute to heat radiation. As a result, it is evaluated that heat can be sufficiently radiated from the carbon nanotubes 21 of the heat radiation component 1.

Hence, the heat radiation component 1 (example 1) having carbon nanotubes 21 arranged orthogonal to the surface 10 a of the substrate 10 is confirmed to have an improved heat radiating property compared to the heat radiation component X (comparative example X) having carbon nanotubes 21 arranged in random directions with respect to the surface 10 a of the substrate 10.

Various aspects of the subject-matter described herein are set out non-exhaustively in the following numbered clauses:

1. A method for manufacturing a heat radiation component, the method comprising:

-   -   forming a plurality of carbon materials on a predetermined         surface of a substrate by using a CVD (Chemical Vapor         Deposition) method, the plurality of carbon materials being         arranged with spaces in between and oriented orthogonal to the         predetermined surface of the substrate; and     -   forming a plating layer by filling a plating material in the         spaces between the plurality of carbon materials, so that a part         of each of the plurality of carbon materials protrudes from a         surface of the plating layer in a direction opposite to the         substrate.

2. A method for manufacturing a heat radiation component, the method comprising:

-   -   applying a magnetic field in a direction orthogonal to a         predetermined surface of a substrate; and     -   forming a plating layer by performing a plating process on the         predetermined surface of the substrate in the magnetic field by         using a plating liquid having a carbon material dispersed         therein;     -   wherein the forming of the plating layer includes forming a         plurality of carbon materials arranged with spaces in between         and oriented orthogonal to the predetermined surface of the         substrate, and filling a plating material in the spaces between         the plurality of carbon materials, so that a part of each of the         plurality of carbon materials protrudes from a surface of the         plating layer in a direction opposite to the substrate.

All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority or inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. 

What is claimed is:
 1. A heat radiation component comprising: a substrate including a predetermined surface; a plurality of carbon materials arranged with spaces in between; and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials; wherein at least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate, wherein a part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate.
 2. The heat radiation component as claimed in claim 1, wherein all of the plurality of carbon materials are oriented orthogonal to the predetermined surface of the substrate.
 3. The heat radiation component as claimed in claim 1, wherein the plurality of carbon materials include linear materials that stand close together on the predetermined surface of the substrate.
 4. The heat radiation component as claimed in claim 1, wherein at least one of the plurality of carbon materials includes an end that contacts the predetermined surface of the substrate.
 5. The heat radiation component as claimed in claim 1, wherein the plurality of carbon materials are formed of carbon nanotubes.
 6. The heat radiation component as claimed in claim 1, wherein the plating layer is formed of nickel. 